Based on extensive design and fabrication experience.
Shanxu is committed to excellence and customer satisfaction in every aspect of product development.
Shanxu utilized Senior Engineers for technical guidance as well as cooperation with world-class design corporations to increase our level of expertise in design.

Highest Signal Speed: 28Gbps
Max 48 Layers Design
Min BGA Pin-Pith: 0.4mm
Min Line width/space: 2/2 mil
Min Hole: 3 mil
Max Connections: 30000
Max Pin count: 40000
Max BGAs in one board: 44

SI Design: 28G+ high-speed SI design capability
EMC Design: FCC,CISPR,VCCI
RF Design & Analysis
HDI Design: Buried and Blind Via, Via-In-Pad,
Embedded Capacitor & Resistor
FPC Design: 10-layer Rigid + 10-layer Flex
Dfx Design: DFM, DFA, DFT, DFC